The flagship X series smartphone, vivo X200, has become a hot topic nationwide as the new year begins. Powered by MediaTek’s 3nm Dimensity 9400 chipset, this device delivers exceptional performance with its blazing speed, smooth multitasking capabilities, and advanced cooling technology. The vivo X200 entered the Bangladeshi market at the end of December last year.

The strength and efficiency of the Dimensity 9400 chipset are evident in every operation of the vivo X200. This powerful smartphone chipset sets the vivo X200 apart from all other devices, providing users with a hassle-free experience in multitasking, video streaming and live sharing.

One of the key advantages of the Dimensity 9400 chipset is its impressive power efficiency. Built on 2nd-generation TSMC 3nm processing technology, this chipset ensures the device doesn’t overheat even during prolonged photography or videography sessions. As a result, the phone’s battery life is significantly extended.

The cutting-edge chipset technology in vivo X200 has further enhanced its GPU and AI capabilities. The CPU performance is 28% better than its predecessor, while the NPU 890 AI processor provides 35% faster and more efficient AI performance, consuming less power.

In addition to its powerful performance, the vivo X200 features a 50 MP ZEISS telephoto camera, co-engineered with ZEISS, enabling professional-grade photography. Its 5800 mAh BlueVolt battery can perform seamlessly even in extreme cold temperatures as low as -20°C, ensuring uninterrupted functionality.

The vivo X200 is equipped with the latest Funtouch OS 15, which includes advanced features such as Transcript Assist, AI Note Assist and AI Erase for a smarter user experience.